Shanghai Biren Plans About $515 Million Share Placement to Fund AI Chip Ramp

Shanghai Biren Technology Co., Ltd. plans to issue 130 million new H Shares at HK$31.08 apiece, a placement that would raise HK$4.04 billion in gross proceeds, or roughly $515 million, for its AI-chip supply chain and product ramp. The Hong Kong-listed company said the deal is aimed at securing capacity as demand for large language models, multimodal systems and agentic AI strains critical upstream inputs.