Wall Street Banks, Broadcom Arrange $63 Billion Financing for Anthropic's AI Chip Infrastructure

Wall Street's major banks and investment firms have assembled a $63 billion financing package to help AI developer Anthropic pay for Broadcom's custom chips and networking equipment, marking one of the largest infrastructure debt deals tied to the AI buildout. The arrangement, involving Bank of America, Citigroup, Morgan Stanley, and Blackstone, channels funds through a newly created special-purpose vehicle that will purchase Broadcom's technology and lease it to Anthropic, whose lease payments will service the debt.