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Japan Signals AI and Chip Projects for Next Phase of $550 Billion U.S. Investment Pact

  • Infra & Chips
  • Policy & Regulation
  • Funding & M&A

Japan's trade minister said artificial intelligence and semiconductor projects will carry "very significant weight" in the next phase of Tokyo's $550 billion U.S. investment pact. After two energy-and-minerals rounds totaling $109 billion, dedicated AI and chip plants have yet to be named.

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