GlobalFoundries secures $2 billion TSMC pact for US advanced chip packaging production

GlobalFoundries announced a $2 billion, five-year manufacturing agreement with Taiwan Semiconductor Manufacturing Company to produce silicon interposers for TSMC's CoWoS advanced packaging technology in the United States, with the deal sending the semiconductor manufacturer's shares up 7%. The partnership marks a strategic response to a critical production bottleneck in the AI chip supply chain, where advanced packaging capacity has become as constraining as silicon wafer production itself.