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AMD CEO Lisa Su Plans Samsung Chip Talks as AI Memory Supply Tightens

October 7, 2026 at 00:35 EDT

Infra & Chips
Sales & Business

AMD Chief Executive Lisa Su plans to meet Samsung Electronics semiconductor chief Jun Young-hyun on Wednesday, Oct. 7, extending a relationship that has become central to AMD's effort to secure AI memory. The meeting comes as high-bandwidth memory supply, not only GPU design, has become a constraint on data-center AI rollouts.

Oct. 7, 2026 · AMD and Samsung

AI Memory Takes Center Stage

Lisa Su's planned meeting with Samsung's semiconductor chief puts HBM4 supply, foundry options and rack-scale AI systems at the center of AMD's next infrastructure push.

Oct. 7

Planned Samsung meeting

MI455X GPUs per Helios rack

432 GB

HBM4 per MI455X GPU

23.3 TB/s

Peak MI455X memory bandwidth

HBM revenue share is highly concentrated

50%SK hynix

33%Samsung

18%Micron

SK hynix and Samsung together account for roughly 83% of global HBM revenue, making Korean memory supply a strategic bottleneck for AI accelerators.

What the talks connect

March MOU->HBM4 supply->MI455X and Helios->Foundry discussion

Why it helps

A tighter Samsung link gives AMD a clearer path to HBM4-backed AI racks as customer deployments expand.

What is unconfirmed

The planned meeting does not confirm a new supply award, priced startup deal or foundry contract.

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